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Tue 25 |
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Wed 26 |
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Thu 27 |
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Chairperson: Claudia Wiemer & Dominique Mangelinck |
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08:00-08:30 |
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INVITED |
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Vertically Scaled Gate-All-Around Transistors: From Advanced Nano-Contact Engineering to Device Development |
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Guilhem Larrieu,
LAAS-CNRS, France |
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08:30-09:00 |
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INVITED |
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3D-stacking technologies: remaining challenges of co-integration of thin Ni(Pt)Si film and TiSix contacts. |
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Magali Grégoire,
STMicroelectronics, France |
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09:00-09:30 |
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INVITED |
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Enabling III-V and CMOS Synergy: Advances in Contact Technology |
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Philippe Rodriguez,
CEA-Leti, France |
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Characterization and Modeling |
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Chairperson: Martin O`Toole & Ainhoa Romo Negreira |
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10:00-10:30 |
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INVITED |
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Electron and phonon thermal conductivity and scattering rates in metal and non-metal thin films and multilayers |
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Patrick Hopkins,
University of Virginia, USA |
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10:30-11:00 |
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INVITED |
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Photoluminescence Imaging : Shedding Light on the Invisible Defects in Silicon |
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Romain Duru,
STMicroelectronics Crolles, France |
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11:00-11:30 |
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INVITED |
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Defects in Action: Real-time TEM observation of Nickel Silicide Propagation in Silicon Nanowires |
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Esther Adegoke ,
University of Limerick, Ireland |
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11:30-12:00 |
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INVITED |
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Multi-scale correlative investigations of failure mechanisms in two-dimensional crystalline materials |
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Bowen Zhang,
Fraunhofer IKTS Dresden, Germany |
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12:00-12:30 |
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INVITED |
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Thin Films Characterization using Fast Data Acquisition at DiffAbs Beamline (Synchrotron SOLEIL) |
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Cristian Mocuta,
SOLEIL synchrotron , France |
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