PROGRAM
Tue 25 Wed 26 Thu 27
Power Device
Chairperson: Paulina Rincon & Nicola Nastasi
08:00-08:30 INVITED Wide Bandgap Device Technology for Power Efficient and High Temperature Applications Mikael Östling,
KTH, Sweden
08:30-08:50 Nearly-ideal Molybdenum Schottky contacts on AlGaN/GaN heterostructures Simone Milazzo,
University of Catania, Italy
08:50-09:10 Contribution of varying accelerating voltage for S/TEM EELS and EDS analysis of AlGaN/GaN based semiconductors Estève Drouillas,
STMicroelectronics, France
09:10-09:40 INVITED The role of interface chemistry and crystalline defects on the reliability of 4H-SiC MOSFETs Patrick Fiorenza,
CNR-IMM, Italy
09:40-10:10 Coffee Break
Sustainability
Chairperson: Dominique Mangelinck & Christophe Detavernier
10:10-10:40 INVITED Eco-Design in ST: a Sustainable journey Cyril Colin-Madan,
STMicroelectronics Crolles, France
10:40-11:10 INVITED Assessment of environmental footprint of semiconductor manufacturing industry to promote more sustainable processes Isabelle Servin,
CEA-LETI, France
Quantum Devices and 2D Materials
Chairperson: Reinhold Dauskardt & Fabrice Nemouchi
11:10-11:40 INVITED Secondary Ion Mass Spectrometry Measurements of Non-Planar Materials and Devices Pawel Michalowski,
Łukasiewicz - Institute of Microelectronics and Photonics, Poland
11:40-12:10 INVITED Exploring properties and applications of amorphous 2D materials in interconnects using Artificial Intelligence Stephan Roche,
ICREA / ICN2, Spain
12:10-12:30 Epitaxial SrTiO3 thin films on silicon for electro-optical quantum devices Andries Boelen,
imec - KU Leuven, Belgium
12:30-13:30 Lunch
3D integration
Chairperson: Lin Hou & Gayle Murdoch
13:30-14:00 INVITED Hybrid and Fusion Bonding to Enable Advanced Packaging Fumihiro Inoue,
Yokohama National University, Japan
14:00-14:30 INVITED Enabling Ultra Low Temperature Hybrid Bonding for D2W Scaling Veronica Strong,
INTEL, Belgium
14:30-14:50 Surface Analysis of SiO2 for Die-to-Wafer Hybrid Bonding Yuki Yoshihara,
Yokohama National University, Japan
Simulation and Modelling
Chairperson: Christophe Detavernier & Dominique Mangelinck
14:50-15:20 INVITED Engineering electronic and optical properties of semiconductors by tuning the population of dopant defects: first principles simulations of Chalcogen hyperdoped Si Alberto Debernardi,
IMM Agrate Brianza, Italy
15:20-15:40 Analytical evaluation of the interface states on SiO2/4H-SiC n-type MOS Capacitor Marco Zignale,
CNR-IMM, Italy
15:40-16:10 Coffee Break
Silicides and Germanides
Chairperson: Jan Willem Maes & Magali Gregoire
16:10-16:30 Source/drain and silicides for nanosheet device applications Clement Porret,
imec, Belgium
16:30-16:50 Nickel silicide phase change transformation upon nanosecond laser annealing Theo Cabaret,
CEA LETI, France
16:50-17:10 Crystallographic defects in orthorhombic ScSi / Si(001) contacts Bert Pollefliet,
KU Leuven, Belgium
17:10-17:30 A model for the redistribution of Pt during the agglomeration of Ni(Pt)Si thin films Dominique Mangelinck,
CNRS, Aix-Marseille Univ, IM2NP, France
19:00-21:30 Conference Dinner
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