|
Posters (9) - Alphabetical order |
|
|
|
Poster nº
|
Author & Title
|
Abstract
|
|
|
|
|
| 0 |
Bismiya fasni Chakkalakunnan (IM2NP, CNRS, Aix Marseille University, France)
|
|
|
Kinetics of Phase Formation in Ni-Co-Si Ternary system using Bilayer and Alloyed thin films
|
|
|
|
|
| 0 |
Nicholas DALLA VEDOVA (STMicroelectronics, Italy)
|
|
|
WCMP contact slurry influence on the formation of TaNTa barrier residues after metal 1 CuCMP
|
|
|
|
|
| 0 |
Filippo Formoso (STMicroelectronics.nv, Italy)
|
|
|
AlCu crystallography modulation triggered by pre-deposition substrate treatment: implications for grain size and reflectivity.
|
|
|
|
|
| 0 |
FILLOT Frederic (Univ. Grenoble Alpes, CEA, Leti, France)
|
|
|
Cross correlation of DSC / XRD on phase change thin film used in PCRAM technology
|
|
|
|
|
| 0 |
Ilaria Presotto (STMicroelectronics S.R.L., Italy)
|
|
|
Influence of TaN/Ta Barrier Layer Thickness on Wafer Curvature and Via Chain Resistance
|
|
|
|
|
| 0 |
Valentina Robbiano (STMicroelectronics, Italy)
|
|
|
Mechanisms of Edge Over Erosion Formation in Copper CMP
|
|
|
|
|
| 0 |
Karthick SEKAR (IM2NP, AMU, France)
|
|
|
Impact of Ti interlayer on the formation of Co silicides.
|
|
|
|
|
| 0 |
Chihaya Suzuki (Shibaura Institute of Technology, Japan)
|
|
|
Fabrication of RF device using Intercalated Multilayer Graphene / Nickel Layered Conductor
|
|
|
|
|
| 0 |
Yumehito Temmyo (Shibaura Institude of Technology, Japan)
|
|
|
Investigation of Nano-Carbon Cap Formation on Ruthenium by Low Temperature Thermal CVD
|
|
|
|
|
| 0/9 |
| |
