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| INVITED MAM2025 |
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Esther Adegoke (University of Limerick, Ireland)
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Defects in Action: Real-time TEM observation of Nickel Silicide Propagation in Silicon Nanowires
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Cyril Colin-Madan (STMicroelectronics Crolles, France)
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Eco-Design in ST: a Sustainable journey
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Erika Covi (Groningen University, The Netherlands)
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Back-end-of-line integration of emerging memory technologies for neuromorphic edge computing
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Alberto Debernardi (IMM Agrate Brianza, Italy)
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Engineering electronic and optical properties of semiconductors by tuning the population of dopant defects: first principles simulations of Chalcogen hyperdoped Si
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Romain Duru (STMicroelectronics Crolles, France)
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Photoluminescence Imaging : Shedding Light on the Invisible Defects in Silicon
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Patrick Fiorenza (CNR-IMM, Italy)
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The role of interface chemistry and crystalline defects on the reliability of 4H-SiC MOSFETs
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Magali Grégoire (STMicroelectronics, France)
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3D-stacking technologies: remaining challenges of co-integration of thin Ni(Pt)Si film and TiSix contacts.
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Patrick Hopkins (University of Virginia, USA)
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Electron and phonon thermal conductivity and scattering rates in metal and non-metal thin films and multilayers
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Fumihiro Inoue (Yokohama National University, Japan)
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Hybrid and Fusion Bonding to Enable Advanced Packaging
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Guilhem Larrieu (LAAS-CNRS, France)
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Vertically Scaled Gate-All-Around Transistors: From Advanced Nano-Contact Engineering to Device Development
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Pawel Michalowski (Łukasiewicz - Institute of Microelectronics and Photonics, Poland)
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Secondary Ion Mass Spectrometry Measurements of Non-Planar Materials and Devices
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Cristian Mocuta (SOLEIL synchrotron , France)
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Thin Films Characterization using Fast Data Acquisition at DiffAbs Beamline (Synchrotron SOLEIL)
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Mikael Östling (KTH, Sweden)
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Wide Bandgap Device Technology for Power Efficient and High Temperature Applications
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Stephan Roche (ICREA / ICN2, Spain)
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Exploring properties and applications of amorphous 2D materials in interconnects using Artificial Intelligence
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Philippe Rodriguez (CEA-Leti, France)
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Enabling III-V and CMOS Synergy: Advances in Contact Technology
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Isabelle Servin (CEA-LETI, France)
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Assessment of environmental footprint of semiconductor manufacturing industry to promote more sustainable processes
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Veronica Strong (INTEL, Belgium)
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Enabling Ultra Low Temperature Hybrid Bonding for D2W Scaling
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Kazuyoshi Ueno (Shibaura Institute of Technology, Japan)
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Graphene Capping for Advanced Interconnects
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Bowen Zhang (Fraunhofer IKTS Dresden, Germany)
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Multi-scale correlative investigations of failure mechanisms in two-dimensional crystalline materials
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