|
| INVITED MAM2025 |
|
|
Esther Adegoke (University of Limerick, Ireland)
|
|
|
Defects in Action: Real-time TEM observation of Nickel Silicide Propagation in Silicon Nanowires
|
|
|
Cyril Colin-Madan (STMicroelectronics Crolles, France)
|
|
|
Eco-Design in ST: a Sustainable journey
|
|
|
Erika Covi (Groningen University, The Netherlands)
|
|
|
Back-end-of-line integration of emerging memory technologies for neuromorphic edge computing
|
|
|
Alberto Debernardi (IMM Agrate Brianza, Italy)
|
|
|
Engineering electronic and optical properties of semiconductors by tuning the population of dopant defects: first principles simulations of Chalcogen hyperdoped Si
|
|
|
Romain Duru (STMicroelectronics Crolles, France)
|
|
|
Photoluminescence Imaging : Shedding Light on the Invisible Defects in Silicon
|
|
|
Patrick Fiorenza (CNR-IMM, Italy)
|
|
|
The role of interface chemistry and crystalline defects on the reliability of 4H-SiC MOSFETs
|
|
|
Inoue Fumihiro (Yokohama National University, Japan)
|
|
|
Hybrid and Fusion Bonding to Enable Advanced Packaging
|
|
|
Magali Grégoire (STMicroelectronics, France)
|
|
|
3D-stacking technologies: remaining challenges of co-integration of thin Ni(Pt)Si film and TiSix contacts.
|
|
|
Patrick Hopkins (University of Virginia, USA)
|
|
|
Measuring the thermal conductivity and scattering rates of metal and dielectric thin films
|
|
|
Christopher Jezewski (Intel, USA)
|
|
|
Novel Patterning, Improved Epitaxial Quality, and Anisotropic Etest of Ion Beam Deposited In-Plane Ruthenium (0001) Nanowires for Low-Resistivity Interconnects
|
|
|
Guilhem Larrieu (LAAS-CNRS, France)
|
|
|
Vertically Scaled Gate-All-Around Transistors: From Advanced Nano-Contact Engineering to Device Development
|
|
|
Pawel Michalowski (Lukasiewicz Institute for Microelectronics and Photonics, Poland)
|
|
|
Secondary ion mass spectrometry measurements of non-planar materials and devices
|
|
|
Cristian Mocuta (SOLEIL synchrotron , France)
|
|
|
Thin Films Characterization Using Fast Data Acquisition at DiffAbs Beamline
|
|
|
Mikael Östling (KTH, Sweden)
|
|
|
Wide Bandgap Device Technology for Power Efficient and High Temperature Applications
|
|
|
Stephan Roche (ICREA / ICN2, Spain)
|
|
|
Exploring properties and applications of amorphous 2D materials in interconnects using Artificial Intelligence
|
|
|
Philippe Rodriguez (CEA-Leti, France)
|
|
|
Enabling III-V and CMOS Synergy: Advances in Contact Technology
|
|
|
Isabelle Servin (CEA-LETI, France)
|
|
|
Assessment of environmental footprint of semiconductor manufacturing industry to promote more sustainable processes
|
|
|
Kazuyoshi Ueno (Shibaura Institute of Technology, Japan)
|
|
|
Graphene Capping for Advanced Interconnects
|
|
|
Bowen Zhang (Fraunhofer IKTS Dresden, Germany)
|
|
|
Multi-scale correlative investigations of failure mechanisms on two-dimensional crystalline materials
|
|
