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Tue 19 |
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Wed 20 |
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Thu 21 |
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Chairperson: Zhen Zhang (Uppsala University, Sweden) |
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08:30-09:00 |
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INVITED |
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Controlling Ni silicide formation by ion implantation |
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Andre Vantomme,
Katholieke Universiteit Leuven, Belgium |
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09:00-09:20 |
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Formation by nonlinear reactive diffusion of the amorphous Ni silicide upon rapid thermal anneals |
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Dominique Mangelinck,
IM2NP-CNRS-AMU, France |
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09:20-09:40 |
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Innovative approaches on TiSi-based contact development for µTrench IGBT technology: C54-TiSi2 to TiSi phase transition |
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Davide Fagiani,
STMicroelectronics, Italy |
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09:40-10:00 |
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Silicidation of Next Generation of FD-SOI Devices: Effect of P Doping Level in epitaxial Si:P Films |
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Helen Grampeix,
CEA LETI, France |
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10:00-10:20 |
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Thermally Stable Ohmic Contacts on GeSn Layers |
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Philippe Rodriguez,
CEA LETI, France |
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Chairperson: Christopher J. Wilson (Imec, Belgium) |
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10:40-11:10 |
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INVITED |
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Fundamental issues of wetting and interfacial reactivity in electronic packaging |
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Fiqiri Hodaj,
SIMaP, Grenoble, France |
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11:10-11:40 |
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INVITED |
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Electroplating of Aluminum using Ionic Liquids for Bonding, Via and RDL applications |
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Silvia Braun,
Fraunhofer ENAS, Germany |
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11:40-12:00 |
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Chip Package Interaction assessment of WLCSP process steps by 3D FEM Thermo-mechanical simulation |
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Lucrezia Guarino,
STMicroelectronics, Italy |
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12:00-12:20 |
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Proposal Ultrafast Soldering of the BGA package for Carbon Neutrality |
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Seung-Boo Jung,
Sungkyunkwan University, South Korea |
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S8-Memory devices for future applications |
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Chairperson: Loris Vendrame (Micron, Italy) - TBC |
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13:30-14:00 |
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INVITED |
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Memory Technology enabling the future computing systems |
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Paolo Fantini,
Micron technology, Italy |
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14:00-14:30 |
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INVITED |
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Resistive switching memories for spiking neural networks |
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Sabina Spiga,
CNR-IMM, Italy |
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14:30-14:50 |
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Strategic Superposition: Sb2Te3/TiTe2 Superlattices Possess a Low Thermal Conductivity Contrast, Ideal for PCM |
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Seppe Van Dyck,
Ghent University, Belgium |
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14:50-15:10 |
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Parylene C as a memristive material for biocompatible memory and synaptic devices |
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Falk Schaller,
Center for Microtechnologies, Germany |
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Chairperson: Christophe Detavernier (University of Gent, Belgium) |
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15:30-16:00 |
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INVITED |
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Material screening for future diffusion barriers: modelling of binary and ternary metal alloys and detailed experimental analysis of their barrier performance |
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Bettina Wehring,
Fraunhofer IPMS, Germany |
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16:00-16:20 |
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Electrochemical Deposition of Nanotwinned Cu in Damascene Features |
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Aleksandar Radisic,
IMEC, Belgium |
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16:20-16:40 |
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Investigation of carbon-cap formation by thermal CVD using ethanol for ruthenium and molybdenum |
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Kazuyoshi Ueno,
Shibaura Institute of Technology, Japan |
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16:40-18:00 |
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Poster Session |
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20:00-21:30 |
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Conference dinner - Cormorano Sempione Restaurant - More info
Via Angelo Poliziano, 1, 20154 Milano MI, Italia
- Google Maps |
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